Futurebus data connectors

A Genalog product story

Edited by the Electronicstalk editorial team Nov 7, 2002

The Harwin Futurebus connector system is based on a modular 2mm grid for high-density high-speed signal board-to-backplane applications at a datarate of 0.622Gbit/s.

Designed for use in telecomms, networking and high-end computing applications, the Harwin Futurebus connector system is based on a modular 2mm grid for high-density high-speed signal board-to-backplane applications at a datarate of 0.622Gbit/s.

End-to-end stackable PCB receptacles and headers provide design flexibility.

The vertical male headers and right-angle female receptacles are available in one, two, four and eight module formats with four- and five-row options.

Press-fit leads offer fast, solderless connector to PCBs.

Housing are made from high-temperature liquid crystal polymer and the contacts are selective gold/tin-plated.

The components have a current rating of 1A per pin, an initial contact resistance of 25mohm and operate between -55 and +125C.

They are supplied tube packed.