Good conduct helps keep power semis cool

Designers with challenging heat problems can look to a new silicone-gel-based thermal management solution.

Designers with challenging heat problems can look to a new silicone-gel-based thermal management solution.

With outstanding thermal conductivity of 6.5W/m.K and high thermal radiation, this new sheet is ideal for conducting heat away from high power semiconductors.

Very flexible with a natural surface tackiness, air gaps are effectively removed.

Thermal resistance is minimised and firm attachment to the application is ensured.

Good flexibility means that just one sheet can be used cover various ICs.

When combined with a heatsink or metal subject this silicone-based material provides very efficient heat radiation.

The silicone content also provides good electrical insulation.

UL94V0 listed at 0.5mm, temperature dependency is also low with no change in hardness from -40 up to +200C.

Sheet thickness start from just 0.5mm.

Where gaps are too narrow or awkward for a sheet solution, a soft gel paste version is also available for syringe dispensing.

Gel-Mec has a wide range of soft thermal-management materials.

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