Flexible Futurebus connector system
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Harwin product story
Edited by the Electronicstalk editorial team
Jul 3, 2002
Harwin's new Futurebus connector system is a modular 2.00mm grid system for high density, high-speed signal board-to-backplane applications for datarates of 0.622Gbit/s.
Harwin's new Futurebus connector system is a modular 2.00mm grid system for high density, high-speed signal board-to-backplane applications for datarates of 0.622Gbit/s.
The connectors were developed in a joint strategic alliance with Starconn, and are designed for use in telecomms, networking and high-end computing applications.
The Futurebus system offers design flexibility with PCB receptacles and headers that are end to end stackable.
Vertical male headers and right-angle female receptacles are available in one-, two-, four- and eight-module formats with four- and five-row options.
Compliant press fit leads offer fast, solderless application to printed circuit boards.
Housings are manufactured from high temperature liquid crystal polymer (LCP) whilst contacts are selective gold/tin plated for reliability and performance.
The connectors have a current rating of 1.0A per pin, an initial contact resistance of 25mohm and operate between -55 and +125C.
Components are packaged in tubes.
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