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Product category: PCB Connectors
News Release from: Harting | Subject: har-bus HM+
Edited by the Electronicstalk Editorial Team on 11 April 2002

Hard metric connectors go with the
(re)flow

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Harting has introduced a number of new devices in its har-bus HM+ range of hard metric 2mm connectors, which are compatible with the latest high-temperature surface-mount production processes.

Harting has introduced a number of new devices in its har-bus HM+ range of hard metric 2mm connectors, which are compatible with the latest high-temperature surface-mount production processes The new devices can be directly mounted by automated pick-and-place technology, enabling soldering at the same time as other surface-mount components

As more daughtercards are becoming entirely populated with surface-mount components, this means that all components for the daughtercard, including connectors, can now be placed automatically and reflow soldered in one step.

The new connectors have been designed to exploit the latest developments in simultaneous double-sided reflow soldering (SDSRS) and pin-in-hole intrusive reflow (PIHIR) technology.

Harting has integrated open ventilation slots into the wafers and connector housings to provide free air flow, guaranteeing good heat distribution and providing homogeneous heat dissipation to aid uniform cooling of the soldered joints.

The 'open' design of the robust and rigid moulding assures a rapid and even heat distribution even at the high temperatures required for lead-free soldering, while also allowing the utilisation of the familiar temperature profiles.

Another advantage of the open moulding is the short time needed for the heating of all contact rows.

Therefore, when reflow soldering takes place alongside much smaller components, the connector is no longer a time-critical item.

The surface-mount compatible connectors use the same hole configuration as traditional press-fit versions, allowing easy conversion to the new technology.

With this new concept, hard metric 2mm connectors can for the first time be fully integrated into the economic reflow soldering process.

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