Product category:
LCD Modules
News Release from: Hitachi Europe - Display Products Group
Edited by the Electronicstalk Editorial
Team on 12 February 2007
Manufacturing technology eases LCD
upgrades
Hitachi has successfully developed a manufacturing technology suitable for producing low-temperature polysilicon on existing amorphous TFT production lines.
Hitachi has successfully developed a manufacturing technology suitable for producing low-temperature polysilicon on existing amorphous TFT production lines Using Selax technology, a crystallisation technology used for the partial formation of high performance thin polysilicon film, the new manufacturing technology allows the function of low-temperature polysilicon to be added to a section of the amorphous TFT, enabling the production capacity of low-temperature polysilicon to be improved without major investment in the existing amorphous TFT production line
This article was originally published on Electronicstalk on 18 Aug 2003 at 8.00am (UK)
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Hitachi has investigated increasing the low-temperature polysilicon production capacity with a view to expanding VGA production.
Low-temperature polysilicon cannot be produced on existing amorphous TFT production lines where crystallisation of thin film silicon is not possible.
This new manufacturing technology allows silicon crystallisation and transverse growth of crystal grains at the same time by applying a solid laser only to the parts requiring large electron movement, such as the surrounding embedded circuit in the amorphous TFT substrate.
Crystal regions can be formed in place on a large glass substrate with better crystal quality in a shorter period of time than those in the low-temperature polysilicon process using a typical excimer laser.
This technology will be applied to commercial production by the end of this year.
A production system is planned at the V3 line (for 730 x 920mm large substrates) in Mobara City, Chiba Prefecture.
Once the system is in operation, one million units will be added to the production capacity of the existing low-temperature polysilicon production line (two million units per month for 2.2in type).
Additional Selax facilities will be built to increase capacity with future growth in demand.
Selax, used for the development of the manufacturing technology, was presented at the SID2002 (Society for Information Display 2002 International Symposium) international display conference by the Central Research Laboratory of Hitachi in May 2002, and attracted considerable interest as a next generation technology due to its ability to enable processing at any place on a large glass substrate with a high degree of compatibility with the existing low-temperature polysilicon TFT process.
The technology has now been improved further in conjunction with Hitachi Displays and the R and D division of Hitachi, resulting in this manufacturing technology.
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