New member joins joins packaging group
Supresta has joined the The High Density Packaging User Group International (HDP) as a corporate member.
Supresta has joined the The High Density Packaging User Group International (HDP) as a corporate member.
"Supresta brings a strong technical knowledge in the area of flame retardants to HDP, and their support will be particularly beneficial to our Printed Circuit Board (PCB) projects" Marshall Andrews, Executive Director of HDP said.
"They will be an immediate and valuable addition to our halogen-free project, which is working toward more environmentally friendly alternatives for the materials used in electronics manufacturing".
"All of the companies in HDP welcome Supresta as our newest member".
"On behalf of all Suprestas' senior management team and myself, we are extremely pleased to participate in the HDP User Group Consortium" said Mark Buczek, Vice President of Supresta.
"This dynamic industry faces many challenges and Supresta looks forward to helping the industry develop the technical solutions to meet these challenges".
Not what you're looking for? Search the site.
Categories
- Active Components (11,921)
- Passive Components (2,950)
- Design and Development (9,396)
- Enclosures and Panel Products (3,246)
- Interconnection (2,843)
- Electronics Manufacturing, Production, Packaging (3,057)
- Industry News (1,898)
- Optoelectronics (1,616)
- Power Supplies (2,297)
- Subassemblies (4,552)
- Test and Measurement (4,957)