Henkel Loctite Adhesives web site, latest news and contact details

Address:
Technologies House
Wood Lane End
Hemel Hemstead
HP2 4RQ
UK
Telephone: (UK) +44 1442 278000

Listing of all 59 news releases from Henkel Loctite Adhesives:

Adhesives are made for mounting image sensors

As the mobile handset image sensor market continues to expand at a rapid pace, new Loctite brand adhesive products meet the requirements of this significant high volume application.

News from Henkel Loctite Adhesives (22 December 2006)

Materials to make debut in San Francisco

Innovative materials technologies on show at Semicon West aim to deliver new levels of cost and production efficiencies for modern packaging processes.

News from Henkel Loctite Adhesives (13 June 2006)

Underfill technologies explained at symposium

Materials expert Dr Brian Toleno will speak at the upcoming IMAPS Symposium on 26th April 2006 at the European Crystal Conference Centre in Algonquin Heights, Illinois.

News from Henkel Loctite Adhesives (18 April 2006)

Lead-free materials to be experienced at Nepcon

Henkel will showcase several innovative solutions and Pb-free compatible material systems at the Nepcon UK 2006 Lead-Fee Experience.

News from Henkel Loctite Adhesives ( 3 April 2006)

Thermally conductive adhesive in the showcase

Loctite 3876 was chosen to be part of the IPC's Innovative Technology Showcase at the recent APEX show in Anaheim.

News from Henkel Loctite Adhesives ( 9 March 2006)

Underfill cures rapidly at low temperatures

Loctite 3549 is a high flow underfill formulated specifically for use with today's advanced CSP and BGA packages.

News from Henkel Loctite Adhesives (17 February 2006)

Lead-free solder paste handles finer pitches

Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications with CSP lead pitches of 0.5 and 0.4mm.

News from Henkel Loctite Adhesives (15 February 2006)

Fischer to focus on lead-free in the Americas

Henkel Corporation's Electronics Group has appointed Dr Gordon Fischer to the position of Vice President of Sales, Marketing and Technical Service for the Americas.

News from Henkel Loctite Adhesives ( 6 February 2006)

New team bolsters technical support

A new customer support mechanism is designed to deliver unprecedented levels of service and materials expertise for customers in the Americas.

News from Henkel Loctite Adhesives ( 1 February 2006)

Toleno to address SMTA in Toronto

Dr Brian Toleno will speak at the upcoming meeting of the Surface Mount Technology Association's Toronto, Canada Chapter.

News from Henkel Loctite Adhesives (16 January 2006)

Low-pressure moulding process to star at APEX

The Electronics Division of Henkel will again use APEX as the stage to promote one of its most innovative process solutions: Macromelt low-pressure moulding.

News from Henkel Loctite Adhesives (11 January 2006)

Siemens qualifies lead-free solder paste

Multicore LF318 lead-free solder paste has now been successfully qualified by leading CEMs and OEMs such as Siemens.

News from Henkel Loctite Adhesives ( 6 January 2006)

IC adhesives optimised for lead-free processing

Selected Loctite Chipbonders are not only capable of running lead-free, but are designed to optimise lead-free processes, eliminating chip loss and saving components by low temperature curing systems.

News from Henkel Loctite Adhesives (20 December 2005)

Adhesive conducts 40% more heat

Novel technology presents superior levels of thermal conductivity, unique process advantages and excellent reliability on a wide range of substrates.

News from Henkel Loctite Adhesives (14 December 2005)

Encapsulants answer lead-free demands

Two new high-purity dam and fill encapsulants are designed specifically for lead-free processing.

News from Henkel Loctite Adhesives ( 7 December 2005)

Mould compounds pass the lead-free test

The Electronics Group of Henkel has announced the recent customer qualification of a lead-free SOIC package, a result of the company's complete material sets expertise.

News from Henkel Loctite Adhesives (30 November 2005)

Joint venture focuses on epoxy moulding compounds

The Henkel Group has acquired a majority stake in Huawei Electronics, a leading manufacturer of epoxy moulding compounds for semiconductors in China.

News from Henkel Loctite Adhesives (25 November 2005)

Distribution network covers Germanic markets

The Electronics Group of Henkel is preparing to reach out to key regional markets in Germany, Austria and Switzerland with a specialised distribution network for solder wires and fluxes.

News from Henkel Loctite Adhesives (21 October 2005)

Shi looks forward to lead-free challenge

Henkel has promoted Gary Shi to the position of Technical Manager for the Research and Development of Liquid Epoxy products.

News from Henkel Loctite Adhesives ( 5 October 2005)

Lead-free adhesives go on show at Productronica

With a new sense of urgency fuelling the global transition to lead-free, the electronics group of Henkel is using Productronica 2005 to exhibit its comprehensive lead-free product range.