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    <title>RSS News Feed for Henkel Loctite Adhesives - from Electronicstalk</title>
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    <description>Henkel Loctite Adhesives news releases on Electronicstalk</description>
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    <copyright>Copyright (C)2008 Pro-Talk Ltd. All rights reserved.</copyright>
    <pubDate>Sat, 22 Nov 2008 08:00:00 UT</pubDate>
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      <title>Adhesives are made for mounting image sensors</title>
      <description>As the mobile handset image sensor market continues to expand at a rapid pace, new Loctite brand adhesive products meet the requirements of this significant high volume application.</description>
      <pubDate>Fri, 22 Dec 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen158.html</link>
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      <title>Materials to make debut in San Francisco</title>
      <description>Innovative materials technologies on show at Semicon West aim to deliver new levels of cost and production efficiencies for modern packaging processes.</description>
      <pubDate>Tue, 13 Jun 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen157.html</link>
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      <title>Underfill technologies explained at symposium</title>
      <description>Materials expert Dr Brian Toleno will speak at the upcoming IMAPS Symposium on 26th April 2006 at the European Crystal Conference Centre in Algonquin Heights, Illinois.</description>
      <pubDate>Tue, 18 Apr 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen156.html</link>
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      <title>Lead-free materials to be experienced at Nepcon</title>
      <description>Henkel will showcase several innovative solutions and Pb-free compatible material systems at the Nepcon UK 2006 Lead-Fee Experience.</description>
      <pubDate>Mon, 03 Apr 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen155.html</link>
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      <title>Thermally conductive adhesive in the showcase</title>
      <description>Loctite 3876 was chosen to be part of the IPC's  Innovative Technology Showcase at the recent APEX show in Anaheim.</description>
      <pubDate>Thu, 09 Mar 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen154.html</link>
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      <title>Underfill cures rapidly at low temperatures</title>
      <description>Loctite 3549 is a high flow underfill formulated specifically for use with today's advanced CSP and BGA packages.</description>
      <pubDate>Fri, 17 Feb 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen153.html</link>
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      <title>Lead-free solder paste handles finer pitches</title>
      <description>Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications with CSP lead pitches of 0.5 and 0.4mm.</description>
      <pubDate>Wed, 15 Feb 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen152.html</link>
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      <title>Fischer to focus on lead-free in the Americas</title>
      <description>Henkel Corporation's Electronics Group has appointed Dr Gordon Fischer to the position of Vice President of Sales, Marketing and Technical Service for the Americas.</description>
      <pubDate>Mon, 06 Feb 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen151.html</link>
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    <item>
      <title>New team bolsters technical support</title>
      <description>A new customer support mechanism is designed to deliver unprecedented levels of service and materials expertise for customers in the Americas.</description>
      <pubDate>Wed, 01 Feb 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen150.html</link>
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    <item>
      <title>Toleno to address SMTA in Toronto</title>
      <description>Dr Brian Toleno will speak at the upcoming meeting of the Surface Mount Technology Association's Toronto, Canada Chapter.</description>
      <pubDate>Mon, 16 Jan 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen149.html</link>
    </item>
    <item>
      <title>Low-pressure moulding process to star at APEX</title>
      <description>The Electronics Division of Henkel will again use APEX as the stage to promote one of its most innovative process solutions: Macromelt low-pressure moulding.</description>
      <pubDate>Wed, 11 Jan 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen148.html</link>
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    <item>
      <title>Siemens qualifies lead-free solder paste</title>
      <description>Multicore LF318 lead-free solder paste has now been successfully qualified by leading CEMs and OEMs such as Siemens.</description>
      <pubDate>Fri, 06 Jan 2006 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen147.html</link>
    </item>
    <item>
      <title>IC adhesives optimised for lead-free processing</title>
      <description>Selected Loctite Chipbonders are not only capable of running lead-free, but are designed to optimise lead-free processes, eliminating chip loss and saving components by low temperature curing systems.</description>
      <pubDate>Tue, 20 Dec 2005 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen146.html</link>
    </item>
    <item>
      <title>Adhesive conducts 40% more heat</title>
      <description>Novel technology presents superior levels of thermal conductivity, unique process advantages and excellent reliability on a wide range of substrates.</description>
      <pubDate>Wed, 14 Dec 2005 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen145.html</link>
    </item>
    <item>
      <title>Encapsulants answer lead-free demands</title>
      <description>Two new high-purity dam and fill encapsulants are designed specifically for lead-free processing.</description>
      <pubDate>Wed, 07 Dec 2005 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen144.html</link>
    </item>
    <item>
      <title>Mould compounds pass the lead-free test</title>
      <description>The Electronics Group of Henkel has announced the recent customer qualification of a lead-free SOIC package, a result of the company's complete material sets expertise.</description>
      <pubDate>Wed, 30 Nov 2005 08:00:00 UT</pubDate>
      <category>Henkel Loctite Adhesives</category>
      <link>http://www.electronicstalk.com/news/hen/hen143.html</link>
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