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Henkel Loctite Adhesives
All articles from Henkel Loctite Adhesives
Adhesives are made for mounting image sensors
As the mobile handset image sensor market continues to expand at a rapid pace, new Loctite brand adhesive products meet the requirements of this significant high volume application.
News from Electronicstalk, 22 December 2006
Materials to make debut in San Francisco
Innovative materials technologies on show at Semicon West aim to deliver new levels of cost and production efficiencies for modern packaging processes.
News from Electronicstalk, 13 June 2006
Underfill technologies explained at symposium
Materials expert Dr Brian Toleno will speak at the upcoming IMAPS Symposium on 26th April 2006 at the European Crystal Conference Centre in Algonquin Heights, Illinois.
News from Electronicstalk, 18 April 2006
Lead-free materials to be experienced at Nepcon
Henkel will showcase several innovative solutions and Pb-free compatible material systems at the Nepcon UK 2006 Lead-Fee Experience.
News from Electronicstalk, 3 April 2006
Thermally conductive adhesive in the showcase
Loctite 3876 was chosen to be part of the IPC's Innovative Technology Showcase at the recent APEX show in Anaheim.
News from Electronicstalk, 9 March 2006
Underfill cures rapidly at low temperatures
Loctite 3549 is a high flow underfill formulated specifically for use with today's advanced CSP and BGA packages.
News from Electronicstalk, 17 February 2006
Lead-free solder paste handles finer pitches
Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications with CSP lead pitches of 0.5 and 0.4mm.
News from Electronicstalk, 15 February 2006
Fischer to focus on lead-free in the Americas
Henkel Corporation's Electronics Group has appointed Dr Gordon Fischer to the position of Vice President of Sales, Marketing and Technical Service for the Americas.
News from Electronicstalk, 6 February 2006
New team bolsters technical support
A new customer support mechanism is designed to deliver unprecedented levels of service and materials expertise for customers in the Americas.
News from Electronicstalk, 1 February 2006
Toleno to address SMTA in Toronto
Dr Brian Toleno will speak at the upcoming meeting of the Surface Mount Technology Association's Toronto, Canada Chapter.
News from Electronicstalk, 16 January 2006
Low-pressure moulding process to star at APEX
The Electronics Division of Henkel will again use APEX as the stage to promote one of its most innovative process solutions: Macromelt low-pressure moulding.
News from Electronicstalk, 11 January 2006
Siemens qualifies lead-free solder paste
Multicore LF318 lead-free solder paste has now been successfully qualified by leading CEMs and OEMs such as Siemens.
News from Electronicstalk, 6 January 2006
IC adhesives optimised for lead-free processing
Selected Loctite Chipbonders are not only capable of running lead-free, but are designed to optimise lead-free processes, eliminating chip loss and saving components by low temperature curing systems.
News from Electronicstalk, 20 December 2005
Adhesive conducts 40% more heat
Novel technology presents superior levels of thermal conductivity, unique process advantages and excellent reliability on a wide range of substrates.
News from Electronicstalk, 14 December 2005
Encapsulants answer lead-free demands
Two new high-purity dam and fill encapsulants are designed specifically for lead-free processing.
News from Electronicstalk, 7 December 2005
Mould compounds pass the lead-free test
The Electronics Group of Henkel has announced the recent customer qualification of a lead-free SOIC package, a result of the company's complete material sets expertise.
News from Electronicstalk, 30 November 2005
Joint venture focuses on epoxy moulding compounds
The Henkel Group has acquired a majority stake in Huawei Electronics, a leading manufacturer of epoxy moulding compounds for semiconductors in China.
News from Electronicstalk, 25 November 2005
Distribution network covers Germanic markets
The Electronics Group of Henkel is preparing to reach out to key regional markets in Germany, Austria and Switzerland with a specialised distribution network for solder wires and fluxes.
News from Electronicstalk, 21 October 2005
Shi looks forward to lead-free challenge
Henkel has promoted Gary Shi to the position of Technical Manager for the Research and Development of Liquid Epoxy products.
News from Electronicstalk, 5 October 2005
Lead-free adhesives go on show at Productronica
With a new sense of urgency fuelling the global transition to lead-free, the electronics group of Henkel is using Productronica 2005 to exhibit its comprehensive lead-free product range.
News from Electronicstalk, 26 September 2005
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