Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Electronics assembly kits
Edited by the Electronicstalk Editorial
Team on 02 October 2002
High-tech kits for electronics assembly
Henkel Loctite Adhesives has a range of kits designed for the assembly of electronic components onto printed circuit boards.
Henkel Loctite Adhesives has a range of kits designed for the assembly of electronic components onto printed circuit boards The kits are particularly suited to hand assembly, design and prototype projects or rework, and comprise adhesive, activator and dispensing needles, as required
This article was originally published on Electronicstalk on 27 Jul 2004 at 8.00am (UK)
Related stories
Moulding compound speeds SIP integration
Hysol GR9810 is a technologically advanced epoxy moulding compound designed for system in package (SIP) on laminate applications.
Moulding compound handles under-bonnet conditions
Hysol GR725-AG is a high-temperature semiconductor moulding compound ideally suited for under-bonnet automotive applications and capable of withstanding harsh environmental conditions.
Supplied in a handy vacuum pack, each kit comes complete with an instruction leaflet.
Of particular interest to design and development engineers is the Loctite Output Kit.
Used for mounting heatsinks onto electronic components or PCBs, the Loctite thermally conductive adhesive in the kit replaces mechanical methods of securing the assemblies such as clips and stand offs, which take up board space and may require hand assembly.
Further reading
Phase change material boosts thermal performance
Loctite PowerstrateXtreme is a reworkable phase-change thermal interface material ideally suited for use between a heatsink and a variety of heat dissipating components.
Sealant suits automotive modules
Loctite 5252 is a medium-viscosity, UV and moisture curing sealant for post-assembly use on electronic module enclosures.
The high thermal conductivity of the adhesive provides excellent heat dissipation, while its self-shimming property produces a consistent 0.15mm film of adhesive giving predictable thermal transfer performance.
The material cures rapidly at room temperature, is electrically insulating and can be removed where rework is necessary.
The Loctite Output kit comprises Loctite 315 thermally conductive adhesive, 25ml syringe and activator in an 18ml brush top bottle.
Other kits in the range include adhesive kits, which are suitable for securing components onto printed circuit boards to provide resistance to impact shocks and thermal stresses.
The Loctite Tak Pak Kit comprises a high viscosity, clear instant adhesive and spray activator.
Used to secure smaller components to PCB assemblies and attaching ECO wires, it cures in seconds at room temperature and withstands high temperature and thermo-cycling.
For instantly securing larger components, bridging larger gaps or where greater shock resistance is required, the Loctite 4105 Black Tak Kit provides tough joints that are resistant to high temperatures.
The Loctite Chipbonder Kit is a fast curing one part adhesive for bonding surface mount devices to PCBs.
It cures rapidly under UV or IR rays.
For securing metal and plastic fasteners, the Loctite Varnistop kit is ideal for warranty seals, securing trim pot settings and enabling the visual inspection of adjustments.
For corrosion sensitive materials the Loctite Tempflex kit is a single component translucent paste that cures at room temperature to form a high strength flexible rubber bond.
It has applications in military, industrial and automotive electronics that are operating in harsh environments.
(This was Electronicstalk's Top Story on 1 October 2002).
• Henkel Loctite Adhesives: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page

