Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol GR9810
Edited by the Electronicstalk Editorial
Team on 27 July 2004
Moulding compound speeds SIP integration
Hysol GR9810 is a technologically advanced epoxy moulding compound designed for system in package (SIP) on laminate applications.
Hysol GR9810 is a technologically advanced epoxy moulding compound designed for system in package (SIP) on laminate applications Hysol GR9810 epoxy moulding compound is designed for use as an overmould on a wide variety of laminate-based moulded array packages including SIP and flip-chip array packages that have been conventionally underfilled
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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High-tech kits for electronics assembly
Henkel Loctite Adhesives has a range of kits designed for the assembly of electronic components onto printed circuit boards.
The extremely flat nature of the product allows for the entire package to be processed in a nonwarped state, which minimises subsequent steps in the manufacturing process and can result in higher end-of-the-line yields.
Unique product characteristics of Hysol GR9810 include ultralow warpage, the ability to underfill small ICs and passive components and superior adhesion to various laminate substrates.
Further, Hysol GR9810 is a green (no antimony, bromine or phosphorous) moulding compound and is capable of achieving JEDEC Level 2 requirements (substrate dependent) at 260C reflow temperature.
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