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News Release from: Henkel Loctite Adhesives
Edited by the Electronicstalk Editorial
Team on 03 August 2004
Future trends in semiconductor packaging
On 13th July 2004 at San Jose's Marriott Hotel, experts from the semiconductor packaging market presented an in-depth seminar addressing the challenges facing tomorrow's packaging professionals.
On 13th July 2004 at San Jose's Marriott Hotel, experts from the semiconductor packaging market presented a 4-hour, in-depth seminar addressing the challenges facing tomorrow's packaging professionals Cosponsored by SEMI's International Electronics Manufacturing Technology (IEMT) Symposium and Henkel Technologies, the first annual "Future trends in semiconductor packaging" seminar was a tremendous success, attracting over 120 delegates
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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The presentations covered various topics, including: low-k devices/Cu interconnect, lead-free material sets, stacked die packages, the need for "green" packages, thermal management and high speed dispensing.
Presenting the data to a packed house were some of the semiconductor industry's leading experts, including: Mike Steidel of Amkor Technology, Vijay Wakharkar of Intel, Kishor Desai of LSI Logic, Dev Malladi of Sun Microsystems, E Jan Vardaman of TechSearch International, Steve Adamson of Asymtek and Gordon Fisher, Jim Huneke and Michael Todd of Henkel Technologies.
Keeping up with the shifting technology and the regulatory and economic pressures of the microelectronics industry can be overwhelming.
As electronic devices become increasingly smaller, lighter and more powerful, semiconductor professionals are forced to remain up-to-speed with current technologies, while preparing for the inevitable challenges of next-generation packaging.
The seminar presented by Henkel Technologies and IEMT gave attendees a leg up on what tomorrow's manufacturing processes may look like and armed them with data to help prepare for the challenges ahead.
"The goal of this seminar was to educate attendees about the power of partnering with industry leaders and illustrate how these partnerships can yield solutions to some of the biggest challenges in semiconductor packaging", says Bhavesh Muni, Business Manager of Semiconductor Packaging Materials at Henkel Technologies.
"Given the number of attendees the seminar attracted, it is obvious that there is a definite need for this information".
"I believe our goal was achieved and we look forward to presenting an equally compelling programme at next year's Semicon West".
Copies of the conference proceedings are available from Henkel Technologies.
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