Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol GR725-AG
Edited by the Electronicstalk Editorial
Team on 13 August 2004
Moulding compound handles under-bonnet
conditions
Hysol GR725-AG is a high-temperature semiconductor moulding compound ideally suited for under-bonnet automotive applications and capable of withstanding harsh environmental conditions.
Hysol GR725-AG is a high-temperature semiconductor moulding compound ideally suited for under-bonnet automotive applications and capable of withstanding harsh environmental conditions This material replaces epoxy moulding compounds containing brominated flame retardants and antimony trioxide, which can degrade the gold-wire/aluminium-pad interconnects at elevated temperatures, causing increased resistance and reliability issues
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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Hysol GR9810 is a technologically advanced epoxy moulding compound designed for system in package (SIP) on laminate applications.
Hysol GR 725-AG is specifically designed for high-temperature SO packages and surface mount discrete packages operating at high temperatures where good electrical stability is required.
The advanced material incorporates transition metal oxides (US Patent Number 6,432,540) that deliver the best high-temperature performance when compared with competing products using a high temperature operation life resistance test.
Currently, Hysol GR725-AG is being used in power SO packages with continuous-use temperatures up to 200C.
This unique moulding compound has been shown to meet JEDEC Level 1, 260øC reflow profile precondition requirements and incorporates patented green (non-antimony/non-bromine/non-phosphorous) flame retardant technology.
With excellent moulding characteristics, superior adhesion to nickel palladium gold (Ni/Pd/Au) and copper silver (Cu/Ag) lead frames and high productivity properties, Hysol GR725-AG is the ideal material for today's most demanding high-temperature semiconductor applications.
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