Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Loctite 5252
Edited by the Electronicstalk Editorial
Team on 30 August 2004
Sealant suits automotive modules
Loctite 5252 is a medium-viscosity, UV and moisture curing sealant for post-assembly use on electronic module enclosures.
Loctite 5252 is a medium-viscosity, UV and moisture curing sealant for post-assembly use on electronic module enclosures The new material is particularly suited for high-volume automotive electronics manufacturing
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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High-tech kits for electronics assembly
Henkel Loctite Adhesives has a range of kits designed for the assembly of electronic components onto printed circuit boards.
Based on a unique polyether rubber technology, Loctite 5252 is a thixotropic sealant that offers controlled flow, dispensing easily and fully sealing seams without seepage or dripping.
The rapid UV cure characteristic of the product significantly improves throughput, as it allows users to tack the material within seconds and proceed to subsequent processes.
Other beneficial features of Loctite 5252 include a secondary moisture cure mechanism that guarantees complete cure even in shadowed areas and a sealant-incorporated fluorescent dye which enables online inspection for accurate and complete application.
Because of the high bond strength of Loctite 5252, proper sealing is guaranteed for the life of the sealed devices.
This product is ideally suited for passenger compartment, under-body and some under-bonnet modules, and will withstand temperatures from -40 to +125C.
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