Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol GR828
Edited by the Electronicstalk Editorial
Team on 03 September 2004
Green package moulding compund handles
260C reflow
Hysol GR828 is a semiconductor grade moulding compound specifically designed for SO packages with nickel palladium gold (Ni/Pd/Au) or copper silver (Cu/Ag) spot lead frames.
Continuing to lead the industry in innovative and technologically advanced products, Henkel Technologies today announced the latest addition to its family of semiconductor packaging materials Hysol GR828 is a semiconductor grade moulding compound specifically designed for SO packages with nickel palladium gold (Ni/Pd/Au) or copper silver (Cu/Ag) spot lead frames that require JEDEC Level 1 260C reflow and green flame retardant technology
This article was originally published on Electronicstalk on 30 Nov 2005 at 8.00am (UK)
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Mould compounds pass the lead-free test
The Electronics Group of Henkel has announced the recent customer qualification of a lead-free SOIC package, a result of the company's complete material sets expertise.
This innovative material is suitable for a wide range of package types including SO, SOP, SSOP and TSSOP, thus giving semiconductor packaging professionals the versatility and flexibility they require.
Other notable benefits of Hysol GR828 are its excellent moulding characteristics, high productivity and low wire sweep properties.
With a wide processing window, Hysol GR828 is a green (patented) flame-retardant material with no antimony, bromine or phosphorous, with a UL94V0 rating at 3.175mm thickness.
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