Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Multicore MP218
Edited by the Electronicstalk Editorial
Team on 20 October 2004
Solder paste handles high humidity
Multicore MP218 is a halide-free, no-clean solder paste that is pin-testable and offers broad process windows for both printing and reflow.
Multicore MP218 is a halide-free, no-clean solder paste that is pin-testable and offers broad process windows for both printing and reflow Significantly, it also exhibits very high resistance to humidity, a particular advantage for multinational manufacturers wishing to qualify a single solder paste that will perform dependably within assembly environments ranging from arid to humid around the globe
This article was originally published on Electronicstalk on 9 Sep 2005 at 8.00am (UK)
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Even after 24 hours at 75% relative humidity, Multicore MP218 achieves a consistently high degree of coalescence on reflow, and in independent testing to IPC ANSI/J-STD-005 and JIS-Z-3284 standards displays superior slump resistance to its leading competitor.
During printing and assembly, the benefits of specifying MP218 are low paste wastage - the result of superior tack life and an open time of more than 24 hours - and resistance to component movement during high-speed placement, due to its high initial tack force, measured at 1.6g/mm2.
Multicore MP218 is suitable for reflow in air or nitrogen, giving excellent solderability on a wide range of surface finishes.
Post-reflow, the solder paste leaves colourless residues to ease visual inspection.
Being of soft, non-stick consistency, the residues also permit reliable in-circuit testing without clogging test probes, even after being subjected to double reflow and many hundreds of tests.
Multicore MP218 is initially available in Sn62 and Sn63 alloys, and 63S4 alloy where anti-tombstoning properties are desirable.
A lead-free version of the solder paste offering similar process advantages is under development and due to be released shortly.
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