Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol 3323, 3327 and 3329
Edited by the Electronicstalk Editorial
Team on 07 January 2005
Encapsulants have smart card chips
covered
Henkel has three new UV-cure encapsulants for use in smart card IC module manufacturing.
The Electronics group of Henkel has three new UV-cure encapsulants for use in smart card IC module manufacturing The dam-and-fill products are to be marketed under Henkel's Hysol brand and are named Hysol 3323, Hysol 3327 and Hysol 3329
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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Moulding compound speeds SIP integration
Hysol GR9810 is a technologically advanced epoxy moulding compound designed for system in package (SIP) on laminate applications.
Developed using the latest single-component epoxy technology, these encapsulants provide faster curing times, improved adhesion, minimised tape warpage and excellent performance during reliability testing, compared with existing UV- or thermal-cure encapsulants.
All three products are designed specifically for the encapsulation of wire-bonded dies used in smart card ICs.
Hysol 3323 has high viscosity and a thixotropic nature, and is used to form the dam, whereas Hysol 3327 and 3329 are both low viscosity materials used for the fill process.
The physical and chemical properties of the three materials have been closely matched, such that Hysol 3323 dam encapsulant is intended for use only with Hysol 3327 or Hysol 3329 fill encapsulants.
Hysol 3329 has a higher glass transition temperature (Tg) of 155C (compared with 110C for Hysol 3327) and a higher Shore hardness.
Either combination will pass mechanical stress testing and high-reliability tests, typically -55 to +125C temperature cycling and heat/humidity ageing at 85C and 85% relative humidity.
These encapsulants provide many benefits during the manufacture of smart card IC modules.
They are easy to dispense, adhere strongly to a wide range of commonly-used carrier substrates, for example glass epoxy, and possess a low coefficient of thermal expansion (45ppm below Tg and 130ppm above Tg).
Typical UV cure times per IC module are between 26 and 46s.
With the combination of higher process throughput achieved, a long pot life that minimises wastage, and competitive pricing, the potential exists for considerable cost-savings.
Henkel offers an extensive product range for smart card manufacture, including die-attach materials, thermal-cure encapsulants, adhesives for implanting/lamination and NCP/ACP materials for flip-chip attachment.
A dedicated global team is on hand to offer technical and sales/logistics support to customers, ensuring that they derive maximum benefit from the latest developments in product technology.
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