Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Multicore LF318
Edited by the Electronicstalk Editorial
Team on 17 January 2005
Lead-free solder paste has global appeal
Multicore LF318 is a halide-free no-clean pin-testable lead-free solder paste that promises broad process windows for both printing and reflow.
A lead-free solder paste offering outstanding resistance to humidity is being launched by the electronics group of Henkel Multicore LF318 is a halide-free no-clean pin-testable formulation that promises broad process windows for both printing and reflow
This article was originally published on Electronicstalk on 6 Jan 2006 at 8.00am (UK)
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The product has been developed to appeal particularly to multinational manufacturers wishing to qualify a single solder paste that offers reliable, repeatable performance within the assembly environment, under any climatic conditions.
LF318 achieves a consistently high degree of coalescence on reflow even after 72h at 27C and 80% relative humidity, and in testing to IPC ANSI/J-STD-005 and JIS-Z-3284 standards displays excellent resistance to slump.
The main benefits of specifying LF318 are evident during printing and assembly: low paste wastage - the result of superior tack life and an open time greater than 24h - and resistance to component movement during high-speed placement, through its high initial tack force of 2.0g/mm2.
Suitable for reflow in air or nitrogen, LF318 displays excellent solderability on a wide range of surface finishes, including Ni/Au, immersion Sn, immersion Ag and OSP copper.
After reflow, only soft, nonstick, colourless residues remain, easing visual inspection and permitting reliable in-circuit testing without clogging test probes, even after many hundreds of tests following double reflow.
Multicore LF318 is classified ROL0 according to ANSI/J-STD-004, and available in lead-free alloys 96SC (SAC387) and 97SC (SAC305).
For assembly processes that do not require the use of a lead-free solder paste but would benefit from similar humidity resistance advantages to those of LF318, a tin-lead version of the solder paste, Multicore MP218, is available with similar properties.
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