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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Multicore WS300
Edited by the Electronicstalk Editorial Team on 01 March 2005

Pb-free paste keeps it clean

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Multicore WS300 is a high-activity water-washable lead-free solder paste with superior cleaning characteristics and suitable for fine-pitch high-speed printing applications.

Following on the heels of several innovative solder material introductions, the electronics group of Henkel has launched its latest lead-free solder paste, Multicore WS300, a high-activity water-washable material with superior cleaning characteristics and suitable for fine-pitch high-speed printing applications Multicore WS300 exhibits excellent print definition with long open and abandon time capabilities

The high activity flux offers excellent wetting to a wide range of surface finishes, and provides an exceptional reflow process window.

In addition, the material is highly resistant to humidity and slump, and is formulated to minimise any defects due to voiding.

Other unique benefits of WS300 include no visible residue on PCBs washed up to 3 days after being reflowed and superior slump resistance resulting in decreased defects due to bridging.

Multicore WS300 is based on the same flux chemistry as the WS200 tin-lead version and is available in lead-free alloys 96SC (SAC387) and 97SC (SAC305).

Tested in accordance with ANSI J-STD-004, WS300 is classified as ORH1, this paste meets or exceeds test specifications of ANSI/J-STD-004 and 005 for SIR, corrosion, fluorides, and slump.

The product also meets Bellcore GR-78-CORE tests for electromigration and SIR.

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