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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Multicore MF210
Edited by the Electronicstalk Editorial Team on 03 March 2005

Flexible flux keeps it clean

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A new no-clean resin-free halide-free sustained activity flux provides maximum process window, boasts good through-hole penetration and reduces costs.

Multicore MF210 is a new no-clean resin-free halide-free sustained activity flux which is extremely robust, provides maximum process window, boasts good through-hole penetration and reduces costs like other no-clean products Designed specifically for surfaces with poor solderability and compatible with all solder alloys, Multicore MF210 is now available to electronics professionals worldwide

The no-clean halide-free sustained activity flux has been formulated to work over a wide range of solder resists and is compatible with rosin and OSP based surface preservatives.

Multicore MF210 offers a maximum process window without resin, which satisfies the demand for applications requiring high performance and reliability.

Additionally, the material allows for high speed soldering on conventional leaded and surface-mount components, good through hole penetration and is designed for optimum wetting of surfaces.

And, Multicore MF210's no clean characteristic reduces manufacturers' costs, while ensuring minimal residues so that there is no interference with test probes.

The liquid flux has been formulated for use in foam, spray or wave fluxes similar to ordinary fluxes on standard wave soldering machines.

Multicore MF210 meets or exceeds the IPC-TM-650 2.3.32 copper mirror test standard, and meets specifications for J-STD-004 SIR and Bellcore GR-78-Core electromigration testing.

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