Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Multicore MF101, MF200, MF300 and MFR301
Edited by the Electronicstalk Editorial
Team on 25 April 2005
Liquid fluxes address specific product
demands
The electronics group of Henkel has introduced several new liquid flux materials to suit varying manufacturing requirements.
Maintaining the company philosophy of personalised customer support, the electronics group of Henkel has introduced several new liquid flux materials to suit varying manufacturing requirements Multicore MF101, MF200, MF300 and MFR301 liquid fluxes have all been made commercially available and address the specific product demands of some of today's more advanced electronics applications
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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Designed mainly for consumer electronics applications using either conventional or nitrogen inerted wave soldering systems, Multicore MF101 and MF300 are both VOC-free, high activity, no-clean liquid fluxes which meet the most demanding legislation on volatile organic compound (VOC) emissions ( less than 1% VOC).
Both materials perform particularly well on low solderability surfaces such as oxidised copper, are formulated to minimise or eliminate solder balling and are nonflammable.
MF101 is suitable for spray application only and MF300 can be applied by spray or foam.
To complement lead-free wave soldering applications, Henkel has introduced MF200 liquid flux.
This material is ideal for consumer electronic products and general electrical lead free soldering applications, especially where there has been a high level of mid-pad solder balling, as this product significantly reduces or eliminates micro solder balling.
And, although the material is designed for lead-free applications, it may also be used with standard lead-containing alloys.
Other benefits of MF200 include an excellent process window and sustained activity, good through hole penetration and minimal residues, which reduces contamination of ATE probes.
Also in its line of advanced flux materials is Henkel's Multicore MFR301 no clean, sustained activity flux, which is ideal for fast soldering on conventional leaded and SMD components.
The activator package in this material is similar to a previous product, but the acid value has been increased to further enhance efficacy, especially when soldering to poorly preserved substrates and components.
MFR301 ensures optimum drainage characteristics at the exit of the wave, which minimises bridges, spiking and mid-pad solder balling.
This material can be applied by foam, spray or wave and, similar to MF200, ensures a maximum process window with minimal residues.
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