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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Loctite QMI529HT
Edited by the Electronicstalk Editorial Team on 26 April 2005

Conductive adhesive handles Pb-free
processing

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Henkel has introduced a new conductive adhesive to address the requirements of higher temperature processes such as lead-free manufacturing.

Always on the forefront of next-generation materials development, the Electronics Group of Henkel has introduced a new conductive adhesive to address the requirements of higher temperature processes such as lead-free manufacturing Delivering excellent electrical conductivity for attachment of integrated circuits (ICs) and components to metallic lead frames, Loctite QMI529HT is a highly silver filled conductive adhesive designed to provide high thermal conductivity

The material's hydrophobic and high temperature stability characteristics produce void-free bond lines with excellent adhesive strength, enabling adhesion to a wide variety of metals and ceramic surfaces, including copper, silver-plated copper and preplated leadframes.

Henkel's patented bismaleimide (BMI) formulation also has particularly robust adhesion to NiPdAu leadframes.

"We are definitely seeing an increase in higher temperature applications", says Ben Santos, Die Attach and TIM1 (Thermal Interface Materials) Global Product Manager for the Electronics Group of Henkel.

"QMI529HT has been specifically formulated to address these challenges, while maintaining flexibility, ease of use, quality and reliability".

"It provides today's advanced packing professionals with a state-of-the art material for their toughest manufacturing requirements".

Designed as a soft-solder replacement or for applications that require high thermal or electrical conductivity, Loctite QMI529HT achieves UPHs that are significantly higher than conventional oven cured adhesives.

With exceptionally fast cure kinetics and very low volatiles, QMI529HT can be SkipCured on the diebonder or on the wirebonder preheater.

This versatility allows the user to begin production using conventional oven cure and then switch to SkipCure, enabling significant cost reductions.

To control bondlines and fillet heights, QMI529HT can also be converted into a controlled collapse spacer paste (CCSP).

Because the spacers do not alter the material properties, manufacturers who qualify QMI529HT first can easily transfer to its CCSP version with full confidence that the package reliability will only improve.

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