Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol QMI600
Edited by the Electronicstalk Editorial
Team on 08 July 2005
Die attach paste survives thermal
cycling
Hysol QMI600 die attach paste provides a low coefficient of thermal expansion and high modulus to match existing mould compound properties.
Hysol QMI600 is the most recent advanced packaging material from Henkel to hit the market A silica-filled, low viscosity, nonconductive die attach paste, Hysol QMI600 provides a low coefficient of thermal expansion (CTE) and high modulus to match existing mould compound properties, which enables wirebonds in same size die stack packages to survive thermal cycling
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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Moulding compound speeds SIP integration
Hysol GR9810 is a technologically advanced epoxy moulding compound designed for system in package (SIP) on laminate applications.
The material's high silica loading and low CTE is accompanied by very low shrinkage, thus minimising warpage during stack up.
However, despite its high silica loading, Hysol QMI600 has low viscosity and optimum thixotropy, enabling ease of dispensing and fillet formation during assembly.
Designed for applications that require high modulus and a low CTE, Hysol QMI600 is particularly well suited for die-to-die bonding in SCSP, BGA, QFN and other packages where die-to-die bonding is required.
With excellent stability at elevated temperatures and hydrophobic properties, Hysol QMI600 produces void-free bond lines with superior adhesion to polyimide, silicon nitride, solder resist, bare silicon and several other surfaces that may present adhesion challenges for competitive products.
Like other Hysol QMI products that deliver exceptional performance, Hysol QMI600 allows users to realise maximum productivity and reduced manufacturing costs through Henkel's SkipCure process where the material can be SkipCured on the diebonder or on the wirebonder preheater.
Manufacturers can begin production using oven cure and transition to SkipCure when production volumes increase.
In addition, Hysol QMI600 can be enhanced with Henkel's patented pliable polymeric spacers, which transform the material into a controlled collapse spacer paste (CCSP).
This version of the product has the same wet and cured properties as the standard Hysol QMI600 version and has been used successfully in production to replace spacer die in same sise die stack applications.
Several notable semiconductor packaging companies have already selected Hysol QMI600 as their material of choice for high-volume production of SCSPs.
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