Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol QMI168
Edited by the Electronicstalk Editorial
Team on 11 July 2005
Conductive adhesive suits leadframe
attachment
Hysol QMI168 is a silver filled conductive adhesive designed specifically for attachment of integrated circuits to metallic leadframes.
Henkel's latest semiconductor packaging material, Hysol QMI168, is a silver filled conductive adhesive designed specifically for attachment of integrated circuits (ICs) to metallic leadframes With hydrophobic properties and excellent stability at high temperatures, Hysol QMI168 produces void-free bond lines and excellent interfacial adhesion to a wide variety of metals and ceramic surfaces
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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Hysol GR9810 is a technologically advanced epoxy moulding compound designed for system in package (SIP) on laminate applications.
The material's compatibility with high temperature processes gives it incredible resistance to delamination and popcorning, even after multiple exposures to reflow temperatures above 260C.
Hysol QMI168 adheres extremely well to copper, gold, silver palladium and Alloy 42, making the product very versatile and providing great manufacturing flexibility.
Hysol QMI168 is designed to achieve UPHs that are significantly higher than those obtainable with conventional oven cure.
Due to its unique formulation, Hysol QMI168 can be SkipCured on the diebonder or on the wirebonder preheater.
This versatility allows the user to begin production using conventional oven cure and then switch to SkipCure, enabling significant cost reductions.
Studies have also shown that parts cured on the diebonder have exhibited improved coplanarity.
Specifically designed for low cost, high volume production applications, Hysol QMI168 has excellent electrical and thermal conductivity properties, is JEDEC Level 1/260C qualified for SO packages, and enables exceptionally high productivity and reliability.
The material is particularly well suited for SOIC, TSOP and other SO packages.
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