Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives
Edited by the Electronicstalk Editorial
Team on 25 July 2005
Research centre focuses materials
expertise
Henkel has relocated its mould compound development, application engineering and technical service capabilities from Olean, New York, to its new Irvine research and applications centre.
With the opening of its advanced research and applications centre in Irvine, California earlier this year, the Electronics Group of Henkel set a new standard for materials development and customer support Now, with the relocation of its mould compound development, application engineering and technical service capabilities from Olean, New York to the new Irvine facility, the company has again raised the bar and can deliver complete material set development capabilities in one location
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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"We know of no other materials company that has such a broad range of materials offerings and the ability to provide tested, compatible material sets for semiconductor packaging and PCB assembly applications", says Dr Larry Crane, Global Director of Research, Development and Engineering for Semiconductor Materials for the Electronics Group of Henkel.
"With the unification of product development in one facility, Henkel now has the capability to develop our mould compounds, die attach products, thermal interface materials, underfills and encapsulants under one roof with a superior technical team".
"This streamlined approach is a win-win for everyone, especially customers who can prototype new packages more quickly, accelerate time to market and do so more cost-effectively".
Further reading
Moulding compound handles under-bonnet conditions
Hysol GR725-AG is a high-temperature semiconductor moulding compound ideally suited for under-bonnet automotive applications and capable of withstanding harsh environmental conditions.
Phase change material boosts thermal performance
Loctite PowerstrateXtreme is a reworkable phase-change thermal interface material ideally suited for use between a heatsink and a variety of heat dissipating components.
The 4900m2, next-generation facility is host to a state-of-the art analytical and failure analysis lab and a 465m2 Class 10,000 clean room which houses some of the most advanced testing and manufacturing equipment available on the market today, including: a Datacon APS 2200 placement system, a DEK Europa screen/stencil printing system for backside wafer coating and a Disco wafer dicing saw.
In addition, the operation boasts a 185m2 surface mount production line with screen printing, reflow and dispensing capabilities which will enable the applications team to evaluate various surface mount assemblies, including Pb-free, 0201s and chip-onboard.
Henkel's material set development expertise extends from semiconductor package material compatibility all the way through to board level, PCB assembly materials compatibility - ensuring that the entire package and material interfaces on the printed circuit board will work together to deliver quality and reliability.
Also unique to Henkel is the way in which its materials development teams are organised.
Instead of developing material sets with individual, material-specific teams (ie a die attach team, an underfills team, etc), Henkel develops its compatible materials with technical teams that are focused on specific package types - SO packages, asymmetric packages such as SiPs and stacked die packages.
"This unique approach to material set development is definitely being validated by our customers", concludes Dr Crane.
"Advanced semiconductor and PCB assembly companies are asking for an integrated material set solution supported by a single company and Henkel is delivering".
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