Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol QMI538NB
Edited by the Electronicstalk Editorial
Team on 29 July 2005
Quick cure for nonconductive die attach
adhesive
Hysol QMI538NB is the latest in a series of new die attach products from Henkel.
Hysol QMI538NB is the latest in a series of new die attach products from Henkel The nonconductive die attach adhesive is a PTFE-filled paste with low viscosity, reduced resin bleed even on open channels and is designed specifically for use with SCSPs or other stacked packages
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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Moulding compound speeds SIP integration
Hysol GR9810 is a technologically advanced epoxy moulding compound designed for system in package (SIP) on laminate applications.
Hysol QMI538NB's unique formulation has been designed to provide hydrophobic properties while also delivering stability at extremely high temperatures with no material deterioration.
Product testing of this material confirms its high reliability and exceptional performance even after multiple exposures to reflow temperatures up to 260C, and its low modulus and low stress make it highly resistant to warpage.
These characteristics enable Hysol QMI538NB to produce void free bondlines with excellent adhesion strength to a wide variety of surfaces, including solder resist, flexible tape, bare silicon, silicon nitride, polyimide and various die passivations.
It is PTFE-filled and does not scratch the most delicate die passivations.
Just like other materials in the QMI portfolio, Hysol QMI538NB enhances productivity and provides increased reliability.
As compared with conventional oven cured adhesives, Hysol QMI538NB is designed to achieve significant cycle time improvement due to Henkel's patented SkipCure process.
The product can be SkipCured on the diebonder or on the wirebonder preheater, the versatility of which allows the user to begin production using conventional oven cure and then switch to SkipCure, enabling significant cost reductions.
Hysol QMI538NB can also be converted into a controlled collapse spacer paste (CCSP) to control bondlines and fillet heights.
Because the spacers do not alter the material properties, manufacturers who qualify Hysol QMI538NB first can easily transfer to its CCSP version and can expect package reliability improvement.
This unique material is JEDEC Level 3 260C qualified.
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