Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol FP4548FC
Edited by the Electronicstalk Editorial
Team on 01 August 2005
Flip-chip underfill is easy to work with
A new advanced material specifically designed as an underfill for flip-chip devices provides superior flow and more robust processing capability compared with competing products.
The Electronics Group of Henkel has brought to market its latest high purity, liquid epoxy encapsulant material, Hysol FP4548FC The advanced material has been designed specifically for use as an underfill for flip-chip devices and provides superior flow and more robust processing capability as compared with competing products
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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Hysol FP4548FC features a low coefficient of thermal expansion (CTE) and low shrinkage - characteristics that are perfect for low-k die applications.
When fully cured, the material creates a rigid, high-strength, low-stress seal that dissipates solder joint stress, greatly extends thermal cycling performance and simplifies the assembly process.
Manufacturers transitioning to lead-free processes can confidently use Hysol FP4548FC, as the material is compatible with Pb-free manufacturing requirements.
The unique formulation of Hysol FP4548FC also makes it ideally suited for flip-chip devices that require crack and fracture resistance and, due to its flux compatibilisers, the material works very well with most available no-clean fluxes.
In most cases, post-assembly flip-chip cleaning processes may be eliminated, saving manufacturing time and capital resources.
Hysol FP4548FC is JEDEC Level 3/260C qualified and is ideal for ASICs and all advanced packages that require a low CTE.
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