Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Multicore MP218
Edited by the Electronicstalk Editorial
Team on 09 September 2005
Solder paste eases process transition
Halide-free no-clean Multicore MP218 solder paste is now optimised to enable modern Sn-Pb processes, allowing for the inevitable interaction with lead-free device finishes.
The Electronics Group of Henkel has announced that the halide-free no-clean Multicore MP218 solder paste is now optimised to enable modern Sn-Pb processes, allowing for the inevitable interaction with lead-free device finishes Multicore MP218 is composed of similar raw materials, activators and other components as those used in next generation lead-free solder pastes
This article was originally published on Electronicstalk on 20 Oct 2004 at 8.00am (UK)
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Multicore MP218 is a halide-free, no-clean solder paste that is pin-testable and offers broad process windows for both printing and reflow.
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Henkel Loctite Adhesives has a range of kits designed for the assembly of electronic components onto printed circuit boards.
However, extra activity and wider reflow capabilities are specifically intended to overcome the wetting issues caused by the combination of Sn-Pb solder and Pb-free device finishes.
"The transition to lead-free means that these are uncertain times for global electronics manufacturers".
"Even if manufacturers are planning to delay their own lead-free transition for as long as possible, some component suppliers have already switched over, whilst others are in the process of transitioning", comments Steve Dowds, Global Product Manager Multicore Solder Products, Henkel.
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"Conventional Sn-Pb materials are not compatible with new lead-free device finishes".
"The higher temperatures required by lead-free means that proper reflow cannot be achieved with a standard lead profile, leading to incomplete wetting and the associated issues of opens and voiding".
"This can tempt assemblers to alter the reflow profile, at the risk of exceeding the capability of most Sn-Pb pastes".
"In contrast, Multicore MP218 is designed to operate under elevated lead-free temperatures which can reach up to 260C".
"Consequently, this new solder paste formulation enables manufacturers to regain control of their processes, effectively closing the gap between lead and lead-free".
Interaction between Sn-Pb solder and Pb-free finishes exacerbates the traditional problems of temperature and humidity variations commonly associated with the rise of lead-free.
A high humidity resistance means that Multicore MP218 is able to avoid the humidity-related problems of premature drying and excessive moisture absorption, enabling a consistent global performance.
The behaviour of the Multicore solder paste is further enhanced by a new anti-tombstoning formulation, designed to extend the liquidus time of the solder during reflow, increasing the wetting window for each end of the component.
This reduces the possibility of costly tombstoning defects to enable effective joint formation.
"Multicore MP218 is specifically designed to overcome issues associated with poor wetting, allowing global electronics manufacturers to adjust their profile temperatures to provide secure joint formation in any environment".
"Multicore MP218 ensures that manufacturers are prepared for any eventuality relating to the lead-free transition, whilst delivering consistent results regardless of location", concludes Doug Dixon, Marketing Manager Electronic Assembly Materials, Henkel.
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