Mould compounds pass the lead-free test

The Electronics Group of Henkel has announced the recent customer qualification of a lead-free SOIC package, a result of the company's complete material sets expertise.

The Electronics Group of Henkel has announced the recent customer qualification of a lead-free SOIC package, a result of the company's complete material sets expertise.

The material set integrates the Hysol GR828H mould compound with the Hysol QM1519 die attach adhesive, combining the excellent moulding characteristics, high productivity and low wire sweep properties of Hysol GR828H with the proven adhesive strength of Hysol QM1519.

The set, designed for both 16-lead and 14-lead SOIC packages, has been optimised through extensive testing to comprehensively meet the demands of lead-free manufacturing.

"With the lead-free deadline fast approaching, it is imperative that companies optimise their processes for this climate", comments Henkel's Michael Todd, Technical Director, Semiconductor Liquids.

"Lead-free has enforced dramatic changes on our market".

"Elevated reflow temperatures mean that new processes must be integrated and entirely compatible, with increased resistance to harsher environments".

"As such, we have found that the complexity of today's manufacturing environment is increasingly driving customer demand for comprehensive material sets solutions supported by a single company".

"Henkel is ideally positioned to deliver this, demonstrated by the qualification of this 'green' materials solution".

Using a Cu/Ni/Au leadframe, the material set has successfully passed through rigorous testing for optimal compatibility.

Henkel's material set development process uses a multilayered approach to testing.

Technical labs in the company's state-of-the-art Irvine facility ensure that material properties are optimised for operation in specific climates.

In the case of this "green" material set, the package achieved MRT reliability for MSL L1 up to 260C, with CSAM images indicating that no delamination occurred at the die top or at the pad.

Meanwhile, high temperature storage conditions testing revealed 0% failure for up to 3000 hours at 210C.

"Ultimately, material set technology is a sound basis for the manufacturing challenges posed by unique environments such as lead-free", concludes Todd.

"As a single material solutions provider, our superior technical teams are integrated to focus on precise package types".

"This means that we are able to deliver specific process benefits - such as decreased costs and design time - direct to our customers".

"As a consequence, Henkel's leading-edge material set development capabilities consistently deliver proven package performances for our customers around the world".

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