Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Multicore LF318
Edited by the Electronicstalk Editorial
Team on 06 January 2006
Siemens qualifies lead-free solder paste
Multicore LF318 lead-free solder paste has now been successfully qualified by leading CEMs and OEMs such as Siemens.
Multicore LF318 lead-free solder paste has now been successfully qualified by leading CEMs and OEMs such as Siemens The halide-free, no-clean, pin-testable Multicore LF318 is specifically formulated to achieve a consistently high degree of coalescence on reflow and incorporates impressive levels of humidity resistance
This article was originally published on Electronicstalk on 17 Jan 2005 at 8.00am (UK)
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Displaying excellent solderability, Multicore LF318 significantly reduces common operational defects such as solder-balling, optimising the lead-free paste for a reliable, repeatable performance.
"The unique properties of Multicore LF318 means that the product is an obvious choice for multinational manufacturers such as Siemens - environments in which leading-edge products demand a high degree of reliability and repeatability", comments Frank Ongkiehong, Director of Application Engineering/Marketing Europe.
"During the printing and assembly processes, Multicore LF318 ensures high efficiency levels - due to a superior print performance and broad reflow process window - combined with high tack for strong resistance to component movement during placement".
"Ultimately, Multicore LF318 is ideally placed for all Pb-free manufacturing environments, with the functionality to surpass even the most rigorous of qualification processes".
As a supplier of progressive technologies, the product qualification process at Siemens is comprehensive - as were the demands placed on Multicore LF318 at the company's Corporate Technology Centre in Berlin.
The paste underwent a series of static tests to measure performance in relation to variables such as corrosion, solder-balling and wetting.
The product was also successfully exposed to a range of dynamic tests to ascertain the behaviour of the paste during printing, evaluating print and slump performance.
"Naturally, Siemens has a rigorous program of standard testing procedures to which all products used by them must adhere", explains Dirk Luh, Business Manager at Henkel.
"However, the fact that lead-free is a relatively new area means that currently, test specifications are not fixed".
"Although the lack of precedent significantly complicates the development of lead-free products such as Multicore LF318, successful qualification by Siemens consequently serves as a guarantee that Multicore LF318 is optimised for superior performance at every level".
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