Lead-free solder paste handles finer pitches

Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications with CSP lead pitches of 0.5 and 0.4mm.

The Electronics Group of Henkel has developed yet another advanced solder material for today's Pb-free process requirements.

Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications with CSP lead pitches of 0.5 and 0.4mm.

As lead-free manufacturing becomes the norm as opposed to the exception, the ability to reliably process finer pitched devices within Pb-free parameters will be vital.

Henkel has anticipated this requirement and has delivered a material solution that addresses the emerging needs of the dynamic electronics market.

Different from competitive products, Multicore LF328 has been formulated to deliver low voiding in BGA joints, which is a characteristic that delivers tremendous production advantages.

With superior performance over a wide range of reflow profiles and long abandon time capabilities, Multicore LF328 gives assemblers of advanced electronic devices the flexibility they require when running lead-free processes.

The material also provides an outstanding tack force to resist component movement during high speed placement, allows a fast print speed with low print pressure to minimise board warpage and offers superior humidity resistance.

These factors, along with the material's excellent soldering activity on a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper, enable manufacturers to confidently incorporate Multicore LF328 into their lead-free production processes.

In addition to its exceptional process performance, Multicore LF328 also helps lower manufacturing costs and maximises production efficiencies.

The material produces safe residues, which eliminate the need for cleaning, and its post-reflow low colour residues simplify the visual inspection process.

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