Lead-free materials to be experienced at Nepcon

Henkel will showcase several innovative solutions and Pb-free compatible material systems at the Nepcon UK 2006 Lead-Fee Experience.

At the upcoming Nepcon Electronics UK exhibition in Birmingham from 9th to 11th May 2006, the Electronics Group of Henkel will participate in the SMART Group's Hands-On Lead-Free Experience 4.

The event gives participants a unique opportunity to view, and use the leading lead-free alloys on modern production equipment.

Henkel, reckoned to be the world's premiere lead-free materials supplier, will showcase several innovative solutions and Pb-free compatible material systems at the Lead-Fee Experience.

Multicore LF318 is a lead-free, no-clean, halide-free solder paste with an extremely wide process window and very long open and abandon time.

The material has superior slump resistance and offers outstanding performance in any climactic condition.

Multicore LF318's exceptional humidity resistance assures its robust performance regardless of changing environmental factors.

The pin-testable paste has excellent solderability characteristics and guarantees compatibility with a wide range of surface finishes.

Multicore MF300 VOC-free liquid flux is a high activity low-residue, resin-free, halide-free flux.

Compatible with lead-free manufacturing processes, Multicore MF300 is highly effective on low solderability surfaces such as oxidised copper and has been designed to minimise solder balling.

The material may be applied by both spray and foam fluxing systems.

Henkel's Multicore cored solder wire is world-renowned for its ease of use and outstanding performance.

Now, this product is available in a comprehensive range of lead-free solder alloys including SAC387, SAC305 and 99C, with other metal variants made available on request.

When using the SAC387 or SAC305 Multicore cored solder wire, compatibility with SMT reflowed solder joints processed with the same alloy is guaranteed.

Well-suited for high speed dispensing on a variety of industry standard machines including ProFlow cassettes for printing, Loctite 3629 is a low temperature cure surface-mount adhesive that meets the industry's highest standards for lead free electronics production withstanding the elevated lead-free processing temperatures.

The low temperature cure requirements of the material make it ideal for applications where heat sensitive materials have to be bonded prior to wave soldering.

And, the lower curing temperature required for Loctite 3629 offer significant cost savings due to reduced energy use.

Visitors to the Lead-Free Experience will have the opportunity to see and test these materials in a real lead-free production simulation environment and can discuss their specific manufacturing challenges and requirements with the expert Henkel technical staff that will be on hand at the event.

Henkel's full line of lead-free solutions and material set innovations will also be highlighted on Stand H30.

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