Underfill technologies explained at symposium

Materials expert Dr Brian Toleno will speak at the upcoming IMAPS Symposium on 26th April 2006 at the European Crystal Conference Centre in Algonquin Heights, Illinois.

Leading electronics industry materials expert Dr Brian Toleno of Henkel Corporation will speak at the upcoming IMAPS Symposium on 26th April 2006 at the European Crystal Conference Centre in Algonquin Heights, Illinois.

In the course of two different presentations, Dr Toleno will discuss various underfill technologies and their role in reliability enhancement for today's advanced CSP and BGA devices and will deliver an overview of successful Pb-free process implementation.

"Dr Toleno's industry experience and knowledge of materials science is extraordinary", says Ken Burke, Technical Programme Chairman of IMAPS.

"We are honoured to have him speak at our upcoming event and, alongside several other prominent industry veterans, share his knowledge with IMAPS members and visitors to the symposium".

Dr Toleno currently serves as Application Engineering Team Leader at the Electronics Group of Henkel in Irvine, California, where he is responsible for overseeing applications work for the company's electronic assembly products, including solder paste, liquid flux, conformal coating, potting, surface mount adhesives, board level underfill, and thermally conductive adhesives.

He is an active participant in several industry organisations including IMAPS, SMTA and IPC.

In addition to cochairing several technical committees with these organisations, Dr Toleno has also published numerous technical papers and articles for leading industry trade journals and has written two chapters for electronic engineering handbooks on adhesives and materials.

Dr Toleno's presentation entitled "Underfill technology: material selection and available technologies" will take place at 0950 local time and the paper entitled "Overview of Pb-free process implementation" will be presented at 1440.

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