Wedge bonder handles varied wires

Edited by the Electronicstalk editorial team May 8, 2008

The Bondjet BJ820 handles all challenging fine pitch wire bonding applications in a single platform, including RF and microwave devices, COB, MCM and hybrids, fibre optics and automotive applications.

The Bondjet BJ820 from Hesse and Knipps is a high-speed, fully automatic wedge bonder that offers the flexibility for both high-speed round wire and deep access ribbon and wire bonding.

It handles all challenging fine pitch wire bonding applications in a single platform, including RF and microwave devices, COB, MCM and hybrids, fibre optics and automotive applications, using aluminium or gold wire or ribbon up to six wires a second.

The looping profiles and height consistencies offered by the Bondjet BJB20 meet and exceed RF/microwave market expectations.

With repeatability of 1um at a balanced encoder resolution of 20nm, the BJ820 Bondjet offers high process stability that enables reliable bonding of extremely small bond pads with a larger wire diameter.

A 304 x 409mm work area can serve as two or more smaller stations for efficient handling of smaller products or substrates.

Coupled with intelligent automation solutions, these features eliminate significant indexing time, resulting in 60% greater throughput than competing machines.

"The Bondjet BJ820 offers very high repeatability for high volume production environments and a large control work area for both wire and ribbon bonding, offering greater throughput than competitive technology", according to Joseph Bubel, President, Hesse and Knipps.

"It offers a cost-effective alternative for ribbon bonding, which is gaining greater popularity for use in high- frequency electronics within the microwave market".

Other significant machine capabilities include: 12.5 to 85um diameter wire bonding, ribbon bonding from 6 x 35 to 25 x 250um and a constant loop height and wire length.

The system maintains parallel loops within a mixed reference system and the auto teach function for linear applications reduces programming time.

The Bondjet BJ820 has a footprint of 720 x 1250mm.