Product category:
Stand-Alone Instruments
News Release from: Hitachi High-Technologies (Electron Microscopy)
Edited by the Electronicstalk Editorial
Team on 25 June 2002
Intel rewards quality improvement
Hitachi High-Technologies is one of just 25 companies to receive the Intel Corp's prestigious 2001 Preferred Quality Supplier (PQS) award.
Hitachi High-Technologies is one of just 25 companies to receive the Intel Corp's prestigious 2001 Preferred Quality Supplier (PQS) award These awards are made to companies for outstanding performance in providing products and services considered essential to Intel's success
This article was originally published on Electronicstalk on 28 Jan 2002 at 8.00am (UK)
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Additional detector brings enhanced imaging
The ultra-high-resolution in-lens S-5200 FESEM from Hitachi High-Technologies has been enhanced with an optional electron detector for imaging backscattered electrons at low accelerating voltages.
Hitachi has won this award for the supply of its etch, CDSEM and defect inspection equipment.
The PQS awards are part of Intel's supplier continuous quality improvement process that encourages suppliers to strive for excellence and continuous improvement.
Suppliers are assessed on their ability to meet cost, quality, availability, technology and responsiveness goals.
They must also manage and deliver on a challenging improvement plan and a quality systems assessment.
This award reinforces Hitachi's reputation as a world-leader in the supply of inspection equipment for the semiconductor industry.
Products include wafer level metrology and inspection systems, such as CD SEMs, optical patterned wafer inspection systems, optical systems for bare wafer inspection and crystal analysis, electron beam wafer inspection tools, thin film deposition measurement and organic residue inspection systems, inspection data management systems and powerful offline analysis instruments Hitachi's award also reflects the company's ability to adapt to changes in the semiconductor industry, including the transition to 0.13 micron and 300mm wafer capability.
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