Product category:
Memory Devices and Modules
News Release from: Hitachi Europe | Subject: HN29W12811BP-60 and HN29V25611ABP-50
Edited by the Electronicstalk Editorial
Team on 12 July 2001
Chip scale packaging shrinks Flash
memories
Hitachi claims its latest chip scale package (CSP) AND-type Flash memories are the industry's smallest.
Hitachi claims its latest chip scale package (CSP) AND-type Flash memories are the industry's smallest The 128Mbit HN29W12811BP-60 and 256Mbit HN29V25611ABP-50 memories feature a mounting area approximately 43% that of Hitachi's thin small outline package (TSOP) devices, making them ideal for applications that require a compact, lightweight design
This article was originally published on Electronicstalk on 16 Feb 2001 at 8.00am (UK)
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These include portable products such as third generation mobile phones, MP3 players, PDAs, and digital cameras.
The small mounting area of the two new memories can reduce the size of systems that incorporate large capacity Flash memory.
When embedding the new devices in a small end product, functions such as AND-type Flash memory operation management, previously performed through hardware by connecting a dedicated controller, are now managed by software.
This software is provided as C-language source code, regardless of microprocessor type.
An AND Flash memory development reference kit is also provided to simplify embedded system design and decrease development times.
System simulation can be carried out on a PC, enabling the evaluation of system performance during the design stage.
The 256Mbit AND-type Flash memory uses a 0.18-micron process to achieve small chip size.
It is mounted in an 11.26 x 9.22mm 72-pin CSP and operates from a supply voltage of 2.7 to 3.6V.
The 128Mbit model is designed using a 0.25-micron process, operates from a supply voltage of 3.0 to 3.6V and uses a similar 72-pin CSP.
Sample shipments of the 128Mbit model will start in July 2001, and in August 2001 for the 256Mbit device.
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