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Product category: Communications ICs (Wired)
News Release from: Hitachi Europe | Subject: THAMIS
Edited by the Electronicstalk Editorial Team on 20 July 2001

Hitachi joins GSM baseband market with
two IC set

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Hitachi has moved into GSM baseband with the launch of the THAMIS baseband chipset.

Hitachi has moved into GSM baseband with the launch of the THAMIS baseband chipset Based on a novel twin-processor SH-DSP architecture, THAMIS offers handset designers a high speed, low power solution that is easily implemented

It supports GSM phase 2+ and GPRS Class 12 operation, and offers a simple upgrade to Edge implementations.

"This move into baseband technology is made possible by our extensive market and design experience", said Chris Litchfield, Manager of Hitachi Europe's Mobile Business Segment.

"The launch of THAMIS completes Hitachi's product range for GSM and next generation mobile handsets, consolidating our position as a key systems supplier for the wireless industry".

Hitachi's GSM system solution includes baseband (THAMIS), RF linear, HPA, SAW-based front-end modules, memory (Flash, SRAM and stacked devices), LCDs and controllers, power management devices, SIM cards and reference design support.

"We more or less provide everything except the plastic", added Litchfield.

"This will benefit our customers by reducing the number of suppliers they need to talk to, saving them time and money".

THAMIS is composed of two baseband chips, the digital THAMIS mobile control processor (T-MCP1), and the mixed-signal THAMIS analogue front end (T-AFE1).

In contrast with the more traditional separation of CPU and DSP, the T-MCP1 processing engine, fabricated in 0.18mm CMOS, uses two powerful SH-DSP cores: the applications core, which operates at up to 52MHz and provides enough processing power to run the value add applications required in today's handsets; and the communications core, which runs at 104MHz (max), sufficient for class 12 multislot GPRS and EDGE systems.

Both cores offer RISC and DSP functionality, allowing new software partitioning options that can be useful when applications space is limited.

The low power 0.35mm T-AFE1 features all the necessary interfaces to support a wide range of radio transceivers, including Hitachi's market proven HD1551xx series.

Its design incorporates both the Edge and standard GMSK modulators.

The chipset enables a standby time of more than 600h on a standard lithium battery and features dual SIM support, MP3 replay and MMC compatibility.

A comprehensive debug toolset is available for use with both cores.

THAMIS and its accompanying layer 1 software have been developed jointly by Hitachi and TTPCom.

This ensures that THAMIS will support the industry standard GSM/GPRS protocol software and applications from TTPCom.

Hitachi and TTPCom together offer support for customers' type approval programs, based on evaluation and reference platforms and software which have already been tested to GCF (GSM Certification Forum) standards.

This means that customers can start designing THAMIS based systems secure in the knowledge that they are using a proven solution.

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