Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Hitachi Europe | Subject: SH7294
Edited by the Electronicstalk Editorial
Team on 27 June 2002
Mobile processor takes camera control
onboard
Hitachi has released the second version of its SH-Mobile application processor.
Hitachi has released the second version of its SH-Mobile application processor The SH7294 incorporates a SH3-DSP CPU core with an operating frequency of 120MHz, and features enhanced camera support and display functions
This article was originally published on Electronicstalk on 16 Feb 2001 at 8.00am (UK)
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The device will enable speedy, low-cost, and space-saving development of next-generation mobile phone systems with built-in cameras.
The SH7294 works alongside the baseband chip of the mobile phone and performs dedicated processing of multimedia applications such as audio and moving pictures.
It has a development platform and comprehensive middleware which enable fast and efficient development of sophisticated systems to meet the increasing demand for mobile phones with built-in cameras and greater functionality.
The processor's enhanced camera-support functions enable direct connection of a VGA-size (640 x 480pixel) camera.
This is expected to be the standard camera for next-generation mobile phones as it enables capture of high-definition images and electronic zoom display.
In addition, on-screen display (OSD) and hardware cursor (HWC) functions allow the implementation of versatile display capabilities such as overlapping screen display.
A comprehensive range of multimedia-oriented middleware is supported by the SH7294, including face-authentication and fingerprint-authentication software, as well as more typical applications such as MPEG-4, JPEG, and MP3.
The Linux operating system is also now supported.
This enables users to develop a wide range of sophisticated applications in a short time-frame according to their specific purposes.
A development platform is available, incorporating a variety of peripheral modules and interfaces that are necessary for next-generation mobile phones, including an interface to AND-type and NAND-type Flash memory.
A keyboard, small LCD panel, and ultra-miniature camera are also included, enabling quick and easy application development.
The SH7294 is available on its own and as part of the new space-saving HJ93D1705BP multi chip module (MCM), which incorporates 1Mbyte SRAM, stack-mounted.
The package used for the SH7294 and the MCM is a 10 x 10 x 1.4mm, 0.5mm-pin-pitch, CSP-225 package.
Sample shipments of both will begin in July 2002.
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