Product category:
Discrete Power Devices
News Release from: Hitachi Europe | Subject: HAT2180RP
Edited by the Electronicstalk Editorial
Team on 19 December 2002
Two MOSFETs in one cut down convertor
designs
Hitachi has developed a 30V drain-source breakdown voltage composite power MOSFET which incorporates chips for both sides of a nonisolated DC/DC convertor in a single package.
Hitachi has developed a 30V drain-source breakdown voltage composite power mosfet which incorporates chips for both sides of a nonisolated DC/DC convertor in a single package The HAT2180RP includes two power mosfets, one with a built-in Schottky barrier diode, and offers higher efficiency than previous Hitachi products
This article was originally published on Electronicstalk on 16 Feb 2001 at 8.00am (UK)
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It is suitable for nonisolated DC/DC convertors, used in products such as notebook PCs, and small motor control.
A nonisolated DC/DC convertor comprises a high-side switch and a low-side switch and uses a power mosfet for each.
In the HAT2180RP, the power mosfet for the high-side switch offers a 43% lower figure of merit of on-resistance for gate-drain charge than previous Hitachi models.
It also offers higher speed (lower switching loss).
The second power mosfet for the low-side switch offers a low on-resistance of 7mohm (at 10V gate-source voltage) in addition to a 3% improvement in efficiency and lower noise than previous Hitachi products.
This is due to the incorporation of a Schottky barrier diode in the same element which makes it possible to eliminate wiring inductance between the mosfet and the diode.
The HAT2180RP, the successor to the HAT2126RP, is for use in a nonisolated DC/DC convertor that converts a 5 to 20V voltage to 1.5 to 5V, and uses 30V drain-source breakdown voltage N-channel power mosfets.
It uses Hitachi's 8th-generation process to provide higher speed and lower on-resistance.
The device is available in a small HSOP-11 surface-mount package (which is the same size as an SOP-14) that measures 8.65 x 6.1 x 1.75mm.
This represents a 17% reduction in size compared with the individual mounting of equivalent Hitachi packages.
Sample shipments have already commenced in Japan.
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