Product category:
Communications ICs (Wireless)
News Release from: Hitachi Europe | Subject: MARS
Edited by the Electronicstalk Editorial
Team on 19 February 2003
Triple-band module cuts handset RF down
to size
Hitachi is claiming the world's smallest, complete triple-band RF subsystem for GSM handsets.
Hitachi is claiming the world's smallest, complete triple-band RF subsystem for GSM handsets The Micro Advanced Radio Solution (MARS) module boasts a tiny footprint of 180mm2 and is compatible with most GSM baseband solutions
This article was originally published on Electronicstalk on 16 Feb 2001 at 8.00am (UK)
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Most integrated GSM RF transceiver so far
Hitachi has launched its most integrated GSM RF transceiver solution to date.
It provides handset manufacturers with a cost-effective and easy-to-use RF system, enabling them to focus expertise on developing other value-added features.
The module is being demonstrated at this week's 3GSM World Congress in Cannes.
The triple-band MARS module integrates power amplifier, RF transceiver, SAW filter, antenna switch and all other components required in the GSM RF subsystem, into two small packages.
This reduces many of the manufacturers' costs, including research and development costs, and improves production yields for the customer.
It also simplifies and minimises the cost of logistics operations, by eliminating the need to procure and mount components separately.
The device resolves many complex design issues, such as RF matching which is fully integrated.
"Vital issues for handset manufacturers remain minimising cost and time-to-market, and there is continuing pressure to integrate more functionality into the same form factor", commented Stephen Graham, RF Product Manager, Hitachi Europe.
"Hitachi has responded to these pressures by developing the smallest available complete triple-band RF solution, that also facilitates a significant reduction in solution cost".
The MARS module is a low-risk, high-yield, two-component solution.
Its modular nature provides manufacturers with an opportunity to optimise the cost of analogue/RF subsystems, whilst allowing the discrete digital baseband chip to take advantage of the latest low-cost, small-geometry digital processes.
The MARS module will be available for production by Q4 2003.
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