Ferrite tiles suppress noisy packages

A novel range of miniature ferrite tiles can be bonded directly onto noisy chips to absorb EMI at source.

A novel approach to solving EMI problems is to go right to the heart of the matter.

RFI Products new ferrite tiles, available from Hitek Electronic Materials can be bonded directly onto noisy chips to absorb EMI at source.

In a range of sizes to fit most processors and support ICs, they are a cost- effective solution.

Intended for bonding directly on to ICs, these ferrite tiles are cut to a range of useful sizes and can be supplied with and without double-sided thermally conductive adhesive tape.

With sizes from 20 x 15 x 1.5mm thick up to 30 x 30mm they fit a range of packages.

Supplied without tape, they can be bonded to a package using one of the twin pack epoxies available from the Emerson and Cuming range.

They can also be supplied with Chomerics Therm-attach T410 and T411 tapes, which are thermally conductive double-sided tapes specially, formulated for bonding to plastic packages.

Thus the ferrite tiles can not only combat EMI but can be part of a thermal management solution.

Back to top