Product category:
VMEbus Boards and Assemblies
News Release from: Hunt Engineering | Subject: HEPC9-EM2
Edited by the Electronicstalk Editorial
Team on 04 February 2003
Module expands real-time DSP systems
Hunt Engineering has released the HEPC9-EM2 - an interboard module for its HEPC9.
Hunt Engineering has released the HEPC9-EM2 - an interboard module for its HEPC9 The interboard modules extend the - architecture across multiple module carrier boards, extending the number of Heron modules that can exist as part of the same real-time system
This article was originally published on Electronicstalk on 9 Apr 2001 at 8.00am (UK)
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Reconfigurable logic boosts DSP module family
Hunt Engineering has extended its Heron range of modular products for digital signal processing to offer modules that use Xilinx FPGAs to offer powerful DSP processing and hugely flexible I/O.
The system can be made up of module carriers in the same host PC, or in different physical locations allowing the deployment of "distributed" systems.
Heron modular DSP systems implement Hunt's HEART (Hunt Engineering architecture using ring technology) which is a software configurable internode communications system based on "virtual FIFOs" that guarantee bandwidth and real time performance.
Inter-board modules such as the HEPC9-EM2 allow the virtual FIFOs of HEART to be connected between boards while maintaining the real time guarantee.
The HEPC9-EM2 uses 1.25Gbit/s serial links to provide six bidirectional connections each capable of up to 125Mbyte/s in each direction.
The system reset and Heron serial configuration bus is also encoded onto the same serial cable making the fact the system is on multiple carriers truly transparent.
Heron systems offer a wide range of DSP modules which includes Texas Instruments' 'C6000 and Xilinx FPGA modules and a variety of high-speed I/O interfaces.
Modules can be mounted on a single carrier or multiple carriers in any chosen combination.
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