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Huntsman Advanced Materials
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Address:
Suites 3 - 12, Level 41 Office Tower
Langham Place, 8 Argyle Street
Kowloon
Hong Kong
Telephone: (Hong Kong) +852 21 4888 23
http://www.huntsman.com
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Listing of all 8 news releases from Huntsman Advanced Materials:
Programme develops barriers
The Systems-in-Foil programme develops advanced polymeric materials for use in innovative barrier structures.
News from Huntsman Advanced Materials (25 October 2007)
Two-component adhesives bond RFID tags
Specialist Araldite adhesives are resistant to water, heat and cleaning chemicals, making them ideal for electronics industry uses including RFID tag bonding.
News from Huntsman Advanced Materials (14 June 2007)
Solder mask and liquid resist aid fine pitch
New materials high registration accuracy and tight clearance in LDI processing.
News from Huntsman Advanced Materials (27 April 2007)
Adhesives encapsulate, insulate and bond
A comprehensive series of high-strength epoxy and polyurethane adhesives provides encapsulation, insulation and bonding of electronic components and PCBs.
News from Huntsman Advanced Materials ( 3 April 2007)
Electronic materials on show in Shanghai
Huntsman Electronics has supported International Electronic Circuits Exhibition in Shanghai since 1999, and this year is presenting a range of advanced products.
News from Huntsman Advanced Materials (20 March 2007)
Silver-filled epoxy conducts heat and current
Araldite 7047 epoxy adhesive is a high purity, 100% solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards.
News from Huntsman Advanced Materials (27 February 2007)
Chinese plant to expand PCB materials production
Huntsman Corp has expanded production capacity for its printed circuit board materials by investing in new production facilities at its site in Panyu, China.
News from Huntsman Advanced Materials (18 January 2007)
UL to assist with due diligence on RoHS
Huntsman Corp has selected Underwriters Laboratories as its RoHS compliance partner.
News from Huntsman Advanced Materials (27 December 2006)
