RSS News Feed for Huntsman Advanced Materials - from Electronicstalk http://www.electronicstalk.com/news/hut/hut000.html Huntsman Advanced Materials news releases on Electronicstalk en-gb Copyright (C)2008 Pro-Talk Ltd. All rights reserved. Tue, 26 Aug 2008 08:00:00 UT Tue, 26 Aug 2008 08:00:00 UT Pro-Talk Ltd http://www.pro-talk.com/images/protalklogo90.gif http://www.pro-talk.com/ 90 79 Programme develops barriers The Systems-in-Foil programme develops advanced polymeric materials for use in innovative barrier structures. Thu, 25 Oct 2007 08:00:00 UT Huntsman Advanced Materials http://www.electronicstalk.com/news/hut/hut107.html Two-component adhesives bond RFID tags Specialist Araldite adhesives are resistant to water, heat and cleaning chemicals, making them ideal for electronics industry uses including RFID tag bonding. Thu, 14 Jun 2007 08:00:00 UT Huntsman Advanced Materials http://www.electronicstalk.com/news/hut/hut106.html Solder mask and liquid resist aid fine pitch New materials high registration accuracy and tight clearance in LDI processing. Fri, 27 Apr 2007 08:00:00 UT Huntsman Advanced Materials http://www.electronicstalk.com/news/hut/hut105.html Adhesives encapsulate, insulate and bond A comprehensive series of high-strength epoxy and polyurethane adhesives provides encapsulation, insulation and bonding of electronic components and PCBs. Tue, 03 Apr 2007 08:00:00 UT Huntsman Advanced Materials http://www.electronicstalk.com/news/hut/hut104.html Electronic materials on show in Shanghai Huntsman Electronics has supported International Electronic Circuits Exhibition in Shanghai since 1999, and this year is presenting a range of advanced products. Tue, 20 Mar 2007 08:00:00 UT Huntsman Advanced Materials http://www.electronicstalk.com/news/hut/hut103.html Silver-filled epoxy conducts heat and current Araldite 7047 epoxy adhesive is a high purity, 100% solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards. Tue, 27 Feb 2007 08:00:00 UT Huntsman Advanced Materials http://www.electronicstalk.com/news/hut/hut102.html Chinese plant to expand PCB materials production Huntsman Corp has expanded production capacity for its printed circuit board materials by investing in new production facilities at its site in Panyu, China. Thu, 18 Jan 2007 08:00:00 UT Huntsman Advanced Materials http://www.electronicstalk.com/news/hut/hut101.html UL to assist with due diligence on RoHS Huntsman Corp has selected Underwriters Laboratories as its RoHS compliance partner. Wed, 27 Dec 2006 08:00:00 UT Huntsman Advanced Materials http://www.electronicstalk.com/news/hut/hut100.html