Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Huntsman Advanced Materials | Subject: Araldite 7047
Edited by the Electronicstalk Editorial
Team on 27 February 2007
Silver-filled epoxy conducts heat and
current
Araldite 7047 epoxy adhesive is a high purity, 100% solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards.
A one-component, silver-filled epoxy adhesive that combines high electrical and thermal conductivity with good bond strength has been introduced by Huntsman Advanced Materials Araldite 7047 epoxy adhesive is a high purity, 100% solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards
This article was originally published on Electronicstalk on 3 Apr 2007 at 8.00am (UK)
Related stories
Adhesives encapsulate, insulate and bond
A comprehensive series of high-strength epoxy and polyurethane adhesives provides encapsulation, insulation and bonding of electronic components and PCBs.
It has an extended work life of up to four days at room temperature and cures quickly in one hour at 165C.
It is high-speed dispensable and stable at room temperature for extended periods.
Araldite 7047 silver-filled epoxy is formulated without solvents or viscosity diluents to reduce potential outgasing.
With its high-temperature performance, Araldite 7047 is compatible with lead-free processing.
Once cured, it exhibits an aluminium/ aluminium lap shear strength of 8MPa and gold/gold die shear of 11MPa at room temperature.
Volume resistivity at room temperature is less than 0.2mohm-cm, even after 1kh aging.
The epoxy has a glass transition temperature of 130C and coefficient of thermal expansion of 72ppm/C.
• Huntsman Advanced Materials: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
