Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Huntsman Advanced Materials | Subject: Probimer 77 and Probimer 355
Edited by the Electronicstalk Editorial
Team on 27 April 2007
Solder mask and liquid resist aid fine
pitch
New materials high registration accuracy and tight clearance in LDI processing.
Huntsman Advanced Materials has reinforced its position as one of the world's leading developers and manufacturers of laser direct imaging materials with the introduction of Probimer 77 LDI solder mask and Probimer 355 LDI liquid resist for image transfer Probimer 77 LDI solder mask has been developed to meet future requirements of solder mask clearances of 25mm and below
This article was originally published on Electronicstalk on 27 Feb 2007 at 8.00am (UK)
Related stories
Silver-filled epoxy conducts heat and current
Araldite 7047 epoxy adhesive is a high purity, 100% solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards.
Adhesives encapsulate, insulate and bond
A comprehensive series of high-strength epoxy and polyurethane adhesives provides encapsulation, insulation and bonding of electronic components and PCBs.
It allows PCB manufacturers to produce fine pitch designs of lower than 0.4mm on large production panel sizes.
Probimer 355 LDI liquid resist for image transfer has been developed to be used in inner layer production or for applications where tenting is not required.
The resist has an excellent LDI capability using low exposure energies.
Both systems offer dual imaging process capabilities, ie they can be exposed using LDI equipment or standard exposure equipment.
This unique property gives high flexibility to the board manufacturer allowing him to select the exposure process according to the required accuracy and tolerances.
Probimer 77 LDI and Probimer 355 LDI materials are based on a unique, proprietary in-house binder technology which has been optimised for advanced photospeed, high resolution and high image accuracy for the production of HDI (high density interconnect) fine pitch BGA boards.
They offer high registration accuracy and tight clearance in LDI processing.
Anders Ekman, Marketing and Business Development Manager of Huntsman Advanced Materials, will present details on the new Probimer LDI materials at an international workshop showcasing the latest LDI technology, hosted by the European Institute of Printed Circuits (EIPC).
The workshop is being held at Laser Imaging Systems in Jena, Germany with an English presentation on Tuesday 8th May 2007 and a German version on Wednesday 9th May 2007.
• Huntsman Advanced Materials: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
