Product category:
Embedded Computing and Control
News Release from: Hybricon Corp
Edited by the Electronicstalk Editorial
Team on 20 January 2005
Avnet signs for help with ruggedised
systems
Avnet Applied Computing Solutions has formed an alliance with Hybricon Corp.
Avnet Applied Computing Solutions, the division of Avnet that provides integration, manufacturing and supply chain management services to industrial OEMs and military prime contractors, has formed an alliance with Hybricon Corp Hybricon is a world-class supplier of electronic packaging-enclosures, backplanes for VME and CompactPCI designs and total custom chassis solutions
This article was originally published on Electronicstalk on 30 Dec 2004 at 8.00am (UK)
Related stories
Backplane meets latest switch fabric specs
Hybricon Corp has a new backplane that complies with the latest PICMG 2.18 specification, which was approved and released in June 2004.
Compact towers keep hot boards cooler
Hybricon Corp has released a new line of nine-slot portable towers designed for today's high power boards.
Because of Hybricon's focus on leading edge enclosure development for high-heat applications, the new relationship will provide Avnet Applied Computing Solutions with enhanced industry-leading services in thermal and structural engineering design prior to prototyping.
These services are ideal for military designs and Hybricon's products can be found in high-altitude aircraft, naval ships, and ruggedised Army/Marines HMMWV applications.
Under the terms of the agreement, Avnet Applied Computing Solutions will use Hybricon's design and programme management expertise to develop custom packaging enclosures.
Further reading
Rugged enclosures keep dense boards cooler
A new line of 10U rack-mount high power enclosures features high quality ruggedised construction and a compact stackable design for vertically mounted cards.
Rack-mount enclosures keep their cool
A new line of 10U rack-mount enclosures have been designed to provide a cost effective platform for high power applications.
Cooling capacity is key to award winning enclosure
The Hybricon RME1021M Series enclosure has been chosen as best standard enclosure of 2005 by EE Product News magazine.
These enclosures will complement Avnet Applied Computing Solutions' engineering, manufacturing and supply chain management services for industrial OEMs and military prime contractors.
"Applications running in thermally challenged environments require unique engineering and design support", said Pat Cathey, President of Avnet Applied Computing Solutions.
"Our new relationship with Hybricon will make it easier for OEMs that require high-heat solutions to integrate the latest technology into a tested, totally customised system designed to meet all specifications and standards for their operational environment, and will enhance the solutions we are able to provide to defence and military customers".
Hybricon's agreement with Avnet Applied Computing Solutions includes design and development solutions requiring thermal, mechanical, signal integrity, electrical and structural engineering - all recognised core competencies of Hybricon.
As an active member of both the PICMG and VITA standards groups, Hybricon maintains leading edge knowledge of all the new switch fabric standards in CompactPCI, Advanced TCA, Compact TCA, VXS and VME64X.
"We are very excited to be teaming with Avnet Applied Computing Solutions and to offer their customers an additional level of engineering services that will extend their reach within the embedded systems markets", said Paul Freve, President of Hybricon.
"Our 27 years of proven engineering leadership in the development of products that excite our customers can now be married with Avnet Applied Computing Solutions' concept design, engineering, manufacturing, systems integration, and supply chain management to yield totally integrated solutions that meet their customer's requirements and usually exceed their expectations".
According to Bob Sullivan, Hybricon's Vice President of Technology: "Advances in silicon technology, together with the emerging embedded computing industry standards from VITA and PICMG, are pushing the envelope on power dissipation and signalling speeds".
"This creates new challenges in backplane signal integrity and system thermal design".
"Hybricon understands the intricacies of these switch fabric based industry standards, and we have the skill set and experience to ensure robust signal integrity and thermal performance of these new systems".
• Hybricon Corp: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
