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IC Interconnect
Address:
1025 Elkton Drive
Colorado Springs
CO 80907
USA
Telephone: (USA) +1 719-533-1030 x36
http://www.icinterconnect.com
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Listing of all 4 news releases from IC Interconnect:
Agreement makes bumps available round the world
Agreement brings electroless Ni UBM processing technology to Asia, and solder-bump, gold-bump and pillar-bump mass production technologies to North America.
News from IC Interconnect ( 4 April 2007)
Pad resurfacing process uses less gold
IC Interconnect's Ni/Au pad resurfacing process for high-temperature wire bond applications produces bonds that are stable at high temperatures with a thinner gold layer.
News from IC Interconnect (20 October 2005)
Wafer bumping services extended
IC Interconnect (ICI), a wafer bumping service company, announces its wafer test, laser marking, die singulation, and tape and reel capabilities available as standard service offerings.
News from IC Interconnect (22 September 2005)
Wafer bumping approved to automotive standards
Wafer bumping service company IC Interconnect has successfully completed its registration audit for ISO/TS16949:2002 and 9001:2000.
News from IC Interconnect ( 6 May 2005)
