http://www.electronicstalk.com/news/icn/icn000.html IC Interconnect news releases on Electronicstalk en-gb Copyright (C)2008 Pro-Talk Ltd. All rights reserved. Tue, 15 Jul 2008 08:00:00 UT Tue, 15 Jul 2008 08:00:00 UT http://www.pro-talk.com/images/protalklogo90.gif http://www.pro-talk.com/ 90 79 Agreement brings electroless Ni UBM processing technology to Asia, and solder-bump, gold-bump and pillar-bump mass production technologies to North America. Wed, 04 Apr 2007 08:00:00 UT IC Interconnect http://www.electronicstalk.com/news/icn/icn103.html IC Interconnect's Ni/Au pad resurfacing process for high-temperature wire bond applications produces bonds that are stable at high temperatures with a thinner gold layer. Thu, 20 Oct 2005 08:00:00 UT IC Interconnect http://www.electronicstalk.com/news/icn/icn102.html IC Interconnect (ICI), a wafer bumping service company, announces its wafer test, laser marking, die singulation, and tape and reel capabilities available as standard service offerings. Thu, 22 Sep 2005 08:00:00 UT IC Interconnect http://www.electronicstalk.com/news/icn/icn101.html Wafer bumping service company IC Interconnect has successfully completed its registration audit for ISO/TS16949:2002 and 9001:2000. Fri, 06 May 2005 08:00:00 UT IC Interconnect http://www.electronicstalk.com/news/icn/icn100.html