How to implement Pb-free at your factory

A one-day seminar entitled "How to implement Pb-free at your factory" will focus on the "how to" of implementing a Pb-free electronics assembly process.

A one-day seminar entitled "How to implement Pb-free at your factory" will focus on the "how to" of implementing a Pb-free electronics assembly process.

The seminar will be held on 16th March 2004 at the Speedline Technologies facility in Foxboro, Massachusetts.

The cost is $295 per person.

The seminar is scheduled to cover these topics: a review of current legislation and practices in lead free electronics assembly; the current alloys in use and why and how they were selected; PWB finishes for lead-free assembly; component concerns in lead-free assembly; Best practices in SMT processes for lead-free assembly - printing, placement, reflow, wave; implementing the lead-free reflow process; special considerations for large boards; and establishing your lead-free implementation plan.

The seminar will also include a special case study: "Implementing lead-free to assemble 5 million cellphones: the Motorola experience".

This will cover: solder paste evaluation; statistical analysis of process data; process optimisation; analysis and corrective actions for failure modes such as tomb stoning; and reliability analysis.

Detailed information will be presented on: the state of lead-free legislation, marketing, and implementation worldwide; the current alloy systems in use and why and how they were chosen; which PWB finishes are preferred in lead-free assembly; the concerns with components and the status of lead-free components in the industry; best practices for setting up your stencil printing, placement, inspection, reflow, and wave; the affect of LF manufacturing on the reflow process, achieving and maintaining the tight process window; how to perform designed experiments to optimise your lead-free process; and how to establish a statistical process control programme.

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